Formerly Janakpur Engineering College (JEC)Affiliated to Tribhuvan University

Odisha silicon carbide chip plant cleared for Rs 3,406 crore

SiCSem's planned plant near Bhubaneswar will make 91 million silicon carbide MOSFETs a year for EVs, chargers and solar inverters.

BEI

A plant to make silicon carbide power chips in Khordha district, Odisha, India, was cleared on 15 September 2026, the Press Trust of India reported via ThePrint. The company, SiCSem, plans to spend Rs 3,406.25 crore. It aims to make 4.8 million silicon carbide diodes and 91.2 million silicon carbide transistors a year.

  • Rs 3,406.25 croretotal project cost
  • 4.8 millionSiC diodes planned per year
  • 1,270people the plant is expected to employ
  • Rs 7,043 croreprojected export turnover over five years
  • Rs 700 crorecentral government capital subsidy

What happened

The Unit Approval Committee of the Falta Special Economic Zone approved the proposal at its 217th meeting. SiCSem Private Limited is a company based in Tamil Nadu. It will build on about 21.9 acres at IDCO Infovalley-II in Khordha district, near Bhubaneswar. A special economic zone is an area with its own customs and tax rules, set up to encourage export-oriented industry.

According to the Press Trust of India, the total cost is Rs 3,406.25 crore. The funding named in the report includes a central government capital subsidy of Rs 700 crore, Rs 350 crore from the Odisha government and Rs 1,956.25 crore from the promoters. ETV Bharat reports that the plant should employ about 1,270 people. Both outlets say it expects export sales of Rs 7,043 crore over five years, with net foreign exchange earnings of about Rs 4,523 crore.

The project is not new. India's Union Cabinet approved it under the India Semiconductor Mission on 12 August 2025, according to the government's Press Information Bureau. At that time, the government said SiCSem was working with Clas-SiC Wafer Fab of the United Kingdom, and that the plant would be the first commercial compound semiconductor fab in India. It gave an annual capacity of 60,000 wafers and packaging capacity of 96 million units.

ETV Bharat describes the plant as Odisha's second semiconductor unit. It reports that the state has received five semiconductor investment proposals worth Rs 10,899 crore so far. Another of these is a glass-based chip packaging unit by 3D Glass Solutions, worth Rs 1,943 crore, whose groundbreaking took place in Bhubaneswar in April 2026. No source gives a date for when SiCSem's plant will start production.

The engineering behind it

Silicon carbide, or SiC, is a compound of silicon and carbon. It is called a wide-bandgap semiconductor. Electrons need more energy to break free in it than in ordinary silicon. In practice, this means SiC devices can block higher voltages in a thinner layer, run at higher temperatures and switch faster with lower losses. These properties matter most in power electronics, where devices handle large currents and hundreds of volts.

The plant will make two kinds of device. A diode lets current flow in one direction only. A MOSFET, or metal-oxide-semiconductor field-effect transistor, is an electronic switch controlled by a voltage on its gate. In a power converter, MOSFETs switch on and off many thousands of times a second to change voltage or turn direct current into alternating current. Every switching event wastes a little energy, so faster and cleaner switching means a more efficient converter.

The government release lists uses for the plant's products: electric vehicles, fast chargers, railways, data centre racks, solar power inverters, consumer appliances, missiles and defence equipment. In an electric car, for example, the traction inverter changes battery power into the alternating current that drives the motor. Less loss in the switches means less heat, smaller cooling systems and more driving range from the same battery.

Making SiC chips is different from making silicon chips. SiC crystals are hard to grow without defects, and the material is very hard to cut and polish. The plant plans to cover the whole chain on one site: fabrication of the devices on wafers, then assembly, testing and packaging. Each step needs process engineers to control the equipment, test engineers to measure every device and quality staff to trace any fault back to its cause.

What it means in Nepal

None of the sources mention Nepal, so this section is about the technology and the skills. SiC switches sit inside many products that are now common across South Asia: electric vehicle chargers, solar inverters and efficient motor drives. An engineer who designs, installs or repairs such equipment needs to understand what the switches do, why they fail and how heat and voltage stress affect them. As SiC parts become more common in such equipment, repair and design work will meet them more often.

The project also shows the range of work a chip plant creates. The 1,270 jobs reported by ETV Bharat will not all be device physicists. A plant like this needs people to run clean rooms, maintain vacuum and gas systems, write test programs, analyse data and manage quality. Many of these roles use the same electronics basics taught in any undergraduate programme, applied with great care and discipline.

Students who want to work with power electronics can practise without a chip factory. Building a small converter or motor driver, measuring its losses and seeing how temperature changes with load teaches the core ideas behind SiC devices. Reading device datasheets carefully, and comparing a silicon switch with a SiC one on paper, is a good first step toward understanding why industries are investing in this material.

What to study if this interests you

Electronic Device and Circuits, ENEX 151, in the second semester of BEI, introduces field-effect transistors, power stages and breakdown diodes, the device ideas behind a SiC MOSFET. Advanced Electronics, ENEX 202, in the third semester, includes power electronics, switched-mode power supplies and drives, where these switches are used. This is where a student learns why switching losses and heat set the size and efficiency of a converter.

Embedded Systems, ENEX 302, in the fifth semester, ends with a chapter on IC technology, which gives an introduction to how integrated circuits are made. Together, these three courses cover the device, the circuit it sits in and the process used to build it. A minor or final-year project that builds and measures a small power converter is a practical way to connect all three.

Words in this story

Wide-bandgap semiconductor
A material such as silicon carbide that needs more energy to conduct than silicon, so it handles higher voltage and heat.
MOSFET
A metal-oxide-semiconductor field-effect transistor, an electronic switch turned on and off by a voltage on its gate.
Traction inverter
The converter in an electric vehicle that turns battery direct current into alternating current for the motor.
Fab
Short for fabrication plant, a factory where semiconductor devices are made on wafers.

Where this comes from

Written in our own words; no sentence is copied from these reports. Researched with AI assistance on 11 October 2026; no member of faculty has reviewed it yet. If you spot a mistake, call 01-5091616 and we will correct it and say so.

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Last reviewed by Imperial College of Engineering. Written 11 October 2026 from the sources above.